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<span id="openzim-page-title" class="mw-page-title-main"><span class="mw-page-title-main">Ball grid array</span></span>

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<p>A <b>ball grid array</b> (<b>BGA</b>) is a type of <a href="Surface-mount" class="mw-redirect" title="Surface-mount">surface-mount</a> packaging (a <a href="Chip_carrier" title="Chip carrier">chip carrier</a>) used for <a href="Integrated_circuit" title="Integrated circuit">integrated circuits</a>. BGA packages are used to permanently mount devices such as <a href="Microprocessor" title="Microprocessor">microprocessors</a>. A BGA can provide more interconnection pins than can be put on a <a href="Dual_in-line_package" title="Dual in-line package">dual in-line</a> or <a href="Quad_Flat_Package" class="mw-redirect" title="Quad Flat Package">flat package</a>. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

</p><p>Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic <a href="Reflow_oven" title="Reflow oven">reflow ovens</a>.

</p>

<div class="mw-heading mw-heading2"><h2 id="Description">Description</h2></div>

<p>The BGA is descended from the <a href="Pin_grid_array" title="Pin grid array">pin grid array</a> (PGA), which is a package with one face covered (or partly covered) with pins in a <a href="Grid_pattern" class="mw-redirect" title="Grid pattern">grid pattern</a> which, in operation, conduct electrical signals between the integrated circuit and the <a href="Printed_circuit_board" title="Printed circuit board">printed circuit board</a> (PCB) on which it is placed. In a BGA, the pins are replaced by pads on the bottom of the package, each initially with a tiny <a href="Solder_ball" title="Solder ball">solder ball</a> stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux.<sup id="cite_ref-indiumcorporation_1-0" class="reference"><a href="#cite_note-indiumcorporation-1"><span class="cite-bracket">[</span>1<span class="cite-bracket">]</span></a></sup> The <a href="SMT_placement_equipment" class="mw-redirect" title="SMT placement equipment">device is placed</a> on a PCB with copper pads in a pattern that matches the solder balls. The assembly is then heated, either in a <a href="Reflow_oven" title="Reflow oven">reflow oven</a> or by an <a href="Infrared_heater" title="Infrared heater">infrared heater</a>, melting the balls. <a href="Surface_tension" title="Surface tension">Surface tension</a> causes the molten solder to hold the package in alignment with the circuit board, at the correct separation distance, while the solder cools and solidifies, forming soldered connections between the device and the PCB.

</p><p>In more advanced technologies, solder balls may be used on both the PCB and the package. Also, in stacked <a href="Multi-chip_module" title="Multi-chip module">multi-chip modules</a>, solder balls are used to connect two packages in a "<a href="Package_on_package" class="mw-redirect" title="Package on package">package on package</a>" configuration.

</p>

<div class="mw-heading mw-heading2"><h2 id="Advantages">Advantages</h2></div>

<div class="mw-heading mw-heading3"><h3 id="High_density">High density</h3></div>

<p>The BGA adresses the problem of producing a miniature package for an integrated circuit with many hundreds of pins. Pin grid arrays and dual-in-line surface mount (<a href="Small-outline_integrated_circuit" class="mw-redirect" title="Small-outline integrated circuit">SOIC</a>) packages were being produced with more and more pins, and with decreasing spacing between the pins, but this was causing difficulties for the soldering process. As package pins got closer together, the danger of accidentally <a href="Solder_bridging" class="mw-redirect" title="Solder bridging">bridging</a> adjacent pins with solder grew.

</p>

<div class="mw-heading mw-heading3"><h3 id="Heat_conduction">Heat conduction</h3></div>

<p>A further advantage of BGA packages over packages with discrete leads (i.e. packages with legs) is the lower <a href="Thermal_resistance" class="mw-redirect" title="Thermal resistance">thermal resistance</a> between the package and the PCB. This allows heat generated by the integrated circuit inside the package to flow more easily to the PCB, preventing the chip from overheating.

</p>

<div class="mw-heading mw-heading3"><h3 id="Low-inductance_leads">Low-inductance leads</h3></div>

<p>The shorter an electrical conductor, the lower its unwanted <a href="Inductance" title="Inductance">inductance</a>, a property which causes unwanted distortion of signals in high-speed electronic circuits. BGAs, with their very short distance between the package and the PCB, have low lead inductances, giving them superior electrical performance over pinned devices.

</p>

<div class="mw-heading mw-heading2"><h2 id="Disadvantages">Disadvantages</h2></div>

<div class="mw-heading mw-heading3"><h3 id="Lack_of_compliance">Lack of compliance</h3></div>

<p>A disadvantage of BGAs is that the solder balls cannot flex in the way that longer leads can, so they are not mechanically <a href="Stiffness#Compliance" title="Stiffness">compliant</a>. As with all surface mount devices, bending due to a difference in <a href="Thermal_expansion" title="Thermal expansion">coefficient of thermal expansion</a> between PCB substrate and BGA (thermal stress) or flexing and vibration (mechanical stress) can cause the solder joints to fracture.

</p><p>Thermal expansion issues can be overcome by matching the mechanical and thermal characteristics of the PCB to those of the package. Typically, plastic BGA devices more closely match PCB thermal characteristics than ceramic devices.

</p><p>The predominant use of <a href="RoHS_compliant" class="mw-redirect" title="RoHS compliant">RoHS compliant</a> lead-free solder alloy assemblies has presented some further challenges to BGAs including "<a href="Head_in_pillow_(metallurgy)" class="mw-redirect" title="Head in pillow (metallurgy)">head in pillow</a>"<sup id="cite_ref-2" class="reference"><a href="#cite_note-2"><span class="cite-bracket">[</span>2<span class="cite-bracket">]</span></a></sup> soldering phenomenon, "<a href="Pad_cratering" title="Pad cratering">pad cratering</a>" problems as well as their decreased reliability versus lead-based solder BGAs in extreme operating conditions such as high temperature, high thermal shock and high gravitational force environments, in part due to lower <a href="Ductility" title="Ductility">ductility</a> of RoHS-compliant solders.<sup id="cite_ref-3" class="reference"><a href="#cite_note-3"><span class="cite-bracket">[</span>3<span class="cite-bracket">]</span></a></sup>

</p><p>Mechanical stress issues can be overcome by bonding the devices to the board through a process called "underfilling",<sup id="cite_ref-underfill_4-0" class="reference"><a href="#cite_note-underfill-4"><span class="cite-bracket">[</span>4<span class="cite-bracket">]</span></a></sup> which injects an epoxy mixture under the device after it is soldered to the PCB, effectively gluing the BGA device to the PCB. There are several types of underfill materials in use with differing properties relative to workability and thermal transfer. An additional advantage of underfill is that it limits <a href="Whisker_(metallurgy)" title="Whisker (metallurgy)">tin whisker</a> growth.

</p><p>Another solution to non-compliant connections is to put a "compliant layer" in the package that allows the balls to physically move in relation to the package. This technique has become standard for packaging DRAMs in BGA packages.

</p><p>Other techniques for increasing the board-level reliability of packages include use of low-expansion PCBs for ceramic BGA (CBGA) packages, <a href="Interposer" title="Interposer">interposers</a> between the package and PCB, and re-packaging a device.<sup id="cite_ref-underfill_4-1" class="reference"><a href="#cite_note-underfill-4"><span class="cite-bracket">[</span>4<span class="cite-bracket">]</span></a></sup>

</p>

<div class="mw-heading mw-heading3"><h3 id="Difficulty_of_inspection">Difficulty of inspection</h3></div>

<p>Once the package is soldered into place, it is difficult to find soldering faults. <a href="X-ray" title="X-ray">X-ray</a> machines, <a href="Industrial_CT_scanning" class="mw-redirect" title="Industrial CT scanning">industrial CT scanning</a> machines,<sup id="cite_ref-5" class="reference"><a href="#cite_note-5"><span class="cite-bracket">[</span>5<span class="cite-bracket">]</span></a></sup> special microscopes, and endoscopes to look underneath the soldered package have been developed to overcome this problem. If a BGA is found to be badly soldered, it can be removed in a <i><a href="Rework_station" class="mw-redirect" title="Rework station">rework station</a></i>, which is a jig fitted with infrared lamp (or hot air), a <a href="Thermocouple" title="Thermocouple">thermocouple</a> and a vacuum device for lifting the package. The BGA can be replaced with a new one, or it can be refurbished (or <i>reballed</i>) and re-installed on the circuit board. Pre-configured solder balls matching the array pattern can be used to reball BGAs when only one or a few need to be reworked. For higher volume and repeated lab work, a stencil-configured vacuum-head pick-up and placement of loose spheres can be used.

</p><p>Due to the cost of visual X-ray BGA inspection, electrical testing is very often used instead. Very common is <a href="Boundary_scan" title="Boundary scan">boundary scan</a> testing using an IEEE 1149.1 <a href="JTAG" title="JTAG">JTAG</a> port.

</p><p>A cheaper and easier inspection method, albeit destructive, is becoming increasingly popular because it does not require special equipment. Commonly referred to as <a href="Dye-and-Pry" class="mw-redirect" title="Dye-and-Pry">dye and pry</a>, the process includes immersing the entire PCB or just the BGA attached module into a <a href="Dye" title="Dye">dye</a>, and after drying, the module is pried off and the broken joins are inspected. If a solder location contains the dye, then it indicates that the connection was imperfect.<sup id="cite_ref-6" class="reference"><a href="#cite_note-6"><span class="cite-bracket">[</span>6<span class="cite-bracket">]</span></a></sup>

</p>

<div class="mw-heading mw-heading3"><h3 id="Difficulties_during_circuit_development">Difficulties during circuit development</h3></div>

<p>During development it is not practical to solder BGAs into place, and sockets are used instead, but tend to be unreliable. There are two common types of socket: the more reliable type has spring pins that push up under the balls, although it does not allow using BGAs with the balls removed as the spring pins may be too short.

</p><p>The less reliable type is a <a href="ZIF_socket" class="mw-redirect" title="ZIF socket">ZIF socket</a>, with spring pinchers that grab the balls. This does not work well, especially if the balls are small.

</p>

<div class="mw-heading mw-heading3"><h3 id="Cost_of_equipment">Cost of equipment</h3></div>

<p>Expensive equipment is required to reliably solder BGA packages; hand-soldering BGA packages is very difficult and unreliable, usable only for the smallest packages in the smallest quantities.<sup id="cite_ref-7" class="reference"><a href="#cite_note-7"><span class="cite-bracket">[</span>7<span class="cite-bracket">]</span></a></sup> However, as more ICs have become available only in leadless (e.g. <a href="Quad-flat_no-leads_package" class="mw-redirect" title="Quad-flat no-leads package">quad-flat no-leads package</a>) or BGA packages, various DIY <a href="Rework_(electronics)#Reflowing_and_reballing" title="Rework (electronics)">reflow</a> methods have been developed using inexpensive heat sources such as <a href="Heat_gun" title="Heat gun">heat guns</a>, and domestic <a href="Toaster#Toaster_oven" title="Toaster">toaster ovens</a> and <a href="Frying_pan#Electric" title="Frying pan">electric skillets</a>.<sup id="cite_ref-8" class="reference"><a href="#cite_note-8"><span class="cite-bracket">[</span>8<span class="cite-bracket">]</span></a></sup>

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<div class="mw-heading mw-heading2"><h2 id="Variants">Variants</h2></div>

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<ul><li><i>CABGA</i>: chip array ball grid array</li>

<li><i>CBGA</i> and <i>PBGA</i> denote the <i>c</i>eramic or <i>p</i>lastic substrate material to which the array is attached.</li>

<li><i>CTBGA</i>: thin chip array ball grid array</li>

<li><i>CVBGA</i>: very thin chip array ball grid array</li>

<li><i>DSBGA</i>: die-size ball grid array</li>

<li><i>FBGA</i>: fine ball grid array based on <i>ball grid array</i> technology. It has thinner contacts and is mainly used in <a href="System-on-a-chip" class="mw-redirect" title="System-on-a-chip">system-on-a-chip</a> designs; <br>also known as <i>fine pitch ball grid array</i> (<a href="JEDEC" title="JEDEC">JEDEC</a>-Standard<sup id="cite_ref-9" class="reference"><a href="#cite_note-9"><span class="cite-bracket">[</span>9<span class="cite-bracket">]</span></a></sup>) or <br><i>fine line BGA</i> by <a href="Altera" title="Altera">Altera</a>. Not to be confused with <i>fortified BGA.</i><sup id="cite_ref-10" class="reference"><a href="#cite_note-10"><span class="cite-bracket">[</span>10<span class="cite-bracket">]</span></a></sup></li>

<li><i>FCmBGA</i>: flip chip molded ball grid array</li>

<li><i>LBGA</i>: low-profile ball grid array</li>

<li><i>LFBGA</i>: low-profile fine-pitch ball grid array</li>

<li><i>MBGA</i>: micro ball grid array</li>

<li><i>MCM-PBGA</i>: multi-chip module plastic ball grid array</li>

<li><i>nFBGA</i>: New Fine Ball Grid Array</li>

<li><i>PBGA</i>: plastic ball grid array</li>

<li><i>SuperBGA (SBGA)</i>: super ball grid array</li>

<li><i>TABGA</i>: tape array BGA</li>

<li><i>TEPBGA</i>: thermally enhanced plastic ball grid array</li>

<li><i>TFBGA</i> or thin and fine ball grid array</li>

<li><i>UFBGA</i> and <i>UBGA</i> and ultra fine ball grid array based on pitch ball grid array.</li>

<li><i>VFBGA</i>: very fine pitch ball grid array</li>

<li><i>WFBGA</i>: very very thin profile fine pitch ball grid array</li></ul>

</div>

<p>Effectively also the <a href="Flip_chip" title="Flip chip">flip chip</a> methods for mounting chip dies to a carrier is sort of a BGA design derivate with the functional equivalent of the balls there being called bumps or micro bumps. This is realized at an already microscopic size level.

</p><p>To make it easier to use ball grid array devices, most BGA packages only have balls in the outer rings of the package,

leaving the innermost square empty.

</p><p>Intel used a package designated BGA1 for their <a href="Pentium_II" title="Pentium II">Pentium II</a> and early <a href="Celeron" title="Celeron">Celeron</a> mobile processors. BGA2 is Intel's package for their <a href="Pentium_III" title="Pentium III">Pentium III</a> and some later Celeron mobile processors. BGA2 is also known as FCBGA-479. It replaced its predecessor, BGA1.

</p><p>For example, the "micro-FCBGA" (flip chip ball grid array) is Intel's current BGA mounting method for mobile processors that use a <a href="Flip_chip" title="Flip chip">flip chip</a> binding technology. It was introduced with the <i>Coppermine</i> Mobile Celeron. Micro-FCBGA has 479 balls that are 0.78 mm in diameter. The processor is affixed to the motherboard by soldering the balls to the motherboard. This is thinner than a pin grid array socket arrangement, but is not removable.

</p><p>The 479 balls of the Micro-FCBGA package (a package almost identical to the 478-pin socketable <a href="Micro-FCPGA" class="mw-redirect" title="Micro-FCPGA">micro-FCPGA</a> package) are arranged as the 6 outer rings of a 1.27 mm pitch (20 balls per inch pitch) 26x26 square grid, with the inner 14x14 region empty.<sup id="cite_ref-11" class="reference"><a href="#cite_note-11"><span class="cite-bracket">[</span>11<span class="cite-bracket">]</span></a></sup><sup id="cite_ref-12" class="reference"><a href="#cite_note-12"><span class="cite-bracket">[</span>12<span class="cite-bracket">]</span></a></sup>

</p>

<div class="mw-heading mw-heading2"><h2 id="Procurement">Procurement</h2></div>

<p>Primary end-users of BGAs are <a href="Original_equipment_manufacturer" title="Original equipment manufacturer">original equipment manufacturers</a> (OEMs). There is also a market among electronic hobbyists <a href="Do_it_yourself" title="Do it yourself">do it yourself (DIY)</a> such as the increasingly popular <a href="Maker_culture" title="Maker culture">maker movement</a>.<sup id="cite_ref-13" class="reference"><a href="#cite_note-13"><span class="cite-bracket">[</span>13<span class="cite-bracket">]</span></a></sup> While OEMs generally source their components from the manufacturer, or the manufacturer's distributor, the hobbyist will typically obtain BGAs on the aftermarket through electronic component brokers or distributors.

</p>

<ul><li><a href="Dual_in-line_package" title="Dual in-line package">Dual in-line package</a> (DIP)</li>

<li><a href="Pin_grid_array" title="Pin grid array">Pin grid array</a> (PGA)</li>

<li><a href="Land_grid_array" title="Land grid array">Land grid array</a> (LGA)</li>

<li><a href="Small-outline_integrated_circuit" class="mw-redirect" title="Small-outline integrated circuit">Small-outline integrated circuit</a> (SOIC)</li>

<li><a href="Chip_carrier" title="Chip carrier">Chip carrier</a>: chip packaging and package types list</li>

<li><a href="Embedded_wafer_level_ball_grid_array" title="Embedded wafer level ball grid array">Embedded wafer level ball grid array</a></li></ul>

<div class="mw-heading mw-heading2"><h2 id="References">References</h2></div>

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</style><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20120303025834/http://www.indium.com/_dynamo/download.php?docid=323">"Soldering 101 - A Basic Overview"</a>. Archived from <a rel="nofollow" class="external text" href="http://www.indium.com/_dynamo/download.php?docid=323">the original</a> on 2012-03-03<span class="reference-accessdate">. Retrieved <span class="nowrap">2010-12-29</span></span>.</cite></span>

</li>

<li id="cite_note-2"><span class="mw-cite-backlink"><b><a href="#cite_ref-2">^</a></b></span> <span class="reference-text"><cite id="CITEREFAlpha2010" class="citation web cs1">Alpha (2010-03-15) [September 2009]. <a rel="nofollow" class="external text" href="https://www.slideshare.net/Alpha1Cookson/head-on-pillow-v3-sept-09">"Reducing Head in Pillow Defects - Head in pillow defects: causes and potential solutions"</a>. 3. <a rel="nofollow" class="external text" href="https://web.archive.org/web/20131203002809/http://www.slideshare.net/Alpha1Cookson/head-on-pillow-v3-sept-09">Archived</a> from the original on 2013-12-03<span class="reference-accessdate">. Retrieved <span class="nowrap">2018-06-18</span></span>.</cite></span>

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<li id="cite_note-3"><span class="mw-cite-backlink"><b><a href="#cite_ref-3">^</a></b></span> <span class="reference-text"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20141008003914/http://teerm.nasa.gov/nasa_dodleadfreeelectronics_proj2.htm">"TEERM - TEERM Active Project - NASA-DOD Lead-Free Electronics (Project 2)"</a>. Teerm.nasa.gov. Archived from <a rel="nofollow" class="external text" href="https://teerm.nasa.gov/NASA_DODLeadFreeElectronics_Proj2.htm">the original</a> on 2014-10-08<span class="reference-accessdate">. Retrieved <span class="nowrap">2014-03-21</span></span>.</cite></span>

</li>

<li id="cite_note-underfill-4"><span class="mw-cite-backlink">^ <a href="#cite_ref-underfill_4-0"><sup><i><b>a</b></i></sup></a> <a href="#cite_ref-underfill_4-1"><sup><i><b>b</b></i></sup></a></span> <span class="reference-text"><a rel="nofollow" class="external text" href="https://archive.today/20130719180947/http://www.electroiq.com/articles/ap/print/volume-10/issue-12/features/bga-underfills.html">Solid State Technology: BGA underfills - Increasing board-level solder joint reliability, 12/01/2001</a></span>

</li>

<li id="cite_note-5"><span class="mw-cite-backlink"><b><a href="#cite_ref-5">^</a></b></span> <span class="reference-text">"CT Services - Overview." Jesse Garant & Associates. August 17, 2010. <cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20100923150138/http://www.jgarantmc.com/ct-services.html">"Industrial Computed Tomography Scanning Services – JG&A"</a>. Archived from <a rel="nofollow" class="external text" href="http://www.jgarantmc.com/ct-services.html">the original</a> on 2010-09-23<span class="reference-accessdate">. Retrieved <span class="nowrap">2010-11-24</span></span>.</cite></span>

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<li id="cite_note-6"><span class="mw-cite-backlink"><b><a href="#cite_ref-6">^</a></b></span> <span class="reference-text"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20111016215109/http://www.cascade-eng.com/CESResourceLib/CS_FA_01.pdf">"Dye and Pry of BGA Solder Joints"</a> <span class="cs1-format">(PDF)</span>. cascade-eng.com. 2013-11-22. Archived from <a rel="nofollow" class="external text" href="http://www.cascade-eng.com/docs/CS_FA_01.pdf">the original</a> <span class="cs1-format">(PDF)</span> on 2011-10-16<span class="reference-accessdate">. Retrieved <span class="nowrap">2014-03-22</span></span>.</cite></span>

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<li id="cite_note-7"><span class="mw-cite-backlink"><b><a href="#cite_ref-7">^</a></b></span> <span class="reference-text"><cite id="CITEREFDas2019" class="citation news cs1">Das, Santosh (2019-08-22). <a rel="nofollow" class="external text" href="http://www.electronicsandyou.com/blog/bga-ball-grid-array-repairing-and-soldering-bga.html">"BGA Soldering & Repairing / How to Solder Ball Grid Array"</a>. <i>Electronics and You</i><span class="reference-accessdate">. Retrieved <span class="nowrap">2021-09-07</span></span>.</cite></span>

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<li id="cite_note-8"><span class="mw-cite-backlink"><b><a href="#cite_ref-8">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external text" href="https://www.sparkfun.com/tutorials/59">Sparkfun tutorials: Reflow skillet, July 2006</a></span>

</li>

<li id="cite_note-9"><span class="mw-cite-backlink"><b><a href="#cite_ref-9">^</a></b></span> <span class="reference-text"><a rel="nofollow" class="external text" href="https://www.jedec.org/standards-documents/docs/dr-427d">Design Requirements - Fine Pitch Ball Grid Array Package (FBGA) DR-4.27D</a>, jedec.org, MAR 2017</span>

</li>

<li id="cite_note-10"><span class="mw-cite-backlink"><b><a href="#cite_ref-10">^</a></b></span> <span class="reference-text">Ryan J. Leng. <a rel="nofollow" class="external text" href="http://www.bit-tech.net/hardware/memory/2007/12/17/the_secrets_of_pc_memory_part_2/4">"The Secrets of PC Memory: Part 2"</a>. 2007.</span>

</li>

<li id="cite_note-11"><span class="mw-cite-backlink"><b><a href="#cite_ref-11">^</a></b></span> <span class="reference-text">Intel.

"Mobile Intel Celeron Processor (0.13 μ) in Micro-FCBGA and Micro-FCPGA Packages".

<a rel="nofollow" class="external text" href="http://pdf.seekdatasheet.com/2008715/200807151345533917.pdf">Datasheet</a> <a rel="nofollow" class="external text" href="https://web.archive.org/web/20140318091556/http://pdf.seekdatasheet.com/2008715/200807151345533917.pdf">Archived</a> 2014-03-18 at the <a href="Wayback_Machine" title="Wayback Machine">Wayback Machine</a>.

2002.</span>

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<li id="cite_note-12"><span class="mw-cite-backlink"><b><a href="#cite_ref-12">^</a></b></span> <span class="reference-text"><cite class="citation web cs1"><a rel="nofollow" class="external text" href="https://web.archive.org/web/20210228145820/http://www.x86-guide.com/en/articles/packages/FCBGA-479%20(Micro-FCBGA)-no56.html">"FCBGA-479 (Micro-FCBGA)"</a>. Archived from <a rel="nofollow" class="external text" href="http://www.x86-guide.com/en/articles/packages/FCBGA-479%20(Micro-FCBGA)-no56.html">the original</a> on 2021-02-28<span class="reference-accessdate">. Retrieved <span class="nowrap">2011-12-20</span></span>.</cite></span>

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<li id="cite_note-13"><span class="mw-cite-backlink"><b><a href="#cite_ref-13">^</a></b></span> <span class="reference-text"><cite class="citation news cs1"><a rel="nofollow" class="external text" href="https://www.economist.com/technology-quarterly/2011/12/03/more-than-just-digital-quilting">"More than just digital quilting: The "maker" movement could change how science is taught and boost innovation. It may even herald a new industrial revolution"</a>. <i>The Economist</i>. Dec 3, 2011.</cite></span>

</li>

</ol></div>

<div class="mw-heading mw-heading2"><h2 id="External_links">External links</h2></div>

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<div class="side-box-text plainlist">The Wikibook <i><a href="https://en.wikibooks.org/wiki/Practical_Electronics" class="extiw external" title="wikibooks:Practical Electronics">Practical Electronics</a></i> has a page on the topic of: <i><b><a href="https://en.wikibooks.org/wiki/Practical_Electronics/PCB_Layout#Board_Thickness_and_Layers" class="extiw external" title="wikibooks:Practical Electronics/PCB Layout">using ball grid arrays</a></b></i></div></div>

</div>

<ul><li><a rel="nofollow" class="external text" href="https://amkor.com/packaging/laminate/pbga/">PBGA Package Information</a> from <a href="Amkor_Technology" title="Amkor Technology">Amkor Technology</a></li>

<li><a rel="nofollow" class="external text" href="https://c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2015/03/PBGA-J-Devices-DSJD401.pdf">PBGA Package Information</a> <a rel="nofollow" class="external text" href="https://web.archive.org/web/20190102095019/https://c44f5d406df450f4a66b-1b94a87d576253d9446df0a9ca62e142.ssl.cf2.rackcdn.com/2015/03/PBGA-J-Devices-DSJD401.pdf">Archived</a> 2019-01-02 at the <a href="Wayback_Machine" title="Wayback Machine">Wayback Machine</a> from J-Devices Corporation</li></ul>

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</style><div id="Semiconductor_packages323" style="font-size:114%;margin:0 4em"><a href="Semiconductor_package" title="Semiconductor package">Semiconductor packages</a></div></th></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Single <a href="Diode" title="Diode">diode</a></th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;"><a href="Semiconductor_device" title="Semiconductor device">3...5-pin</a></th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

<li><a href="TO-3" title="TO-3">TO-3</a> (TH / Panel)</li>

<li><a href="TO-66" title="TO-66">TO-66</a> (TH / Panel)</li>

<li><a href="TO-126" title="TO-126">TO-126</a> (TH / Panel)</li>

<li>TO-202 (TH / Panel)</li>

<li><a href="TO-220" title="TO-220">TO-220</a> (TH / Panel)</li>

<li>TO-247 (TH / Panel)</li>

<li>TO-273 (Super-220) (SMT)</li>

<li>TO-274 (Super-247) (SMT)</li>

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Single row</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Dual row</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

<li><a href="Thin_small_outline_package" title="Thin small outline package">TSOP / HTSOP</a></li>

<li><a href="Thin_shrink_small_outline_package" title="Thin shrink small outline package">TSSOP / HTSSOP</a></li>

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Quad row</th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Grid array</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

<ul>

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;"><a href="Wafer_(electronics)" title="Wafer (electronics)">Wafer</a></th><td class="navbox-list-with-group navbox-list navbox-odd hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

</div></td></tr><tr><th scope="row" class="navbox-group" style="width:1%;text-align:left;">Related topics</th><td class="navbox-list-with-group navbox-list navbox-even hlist" style="width:100%;padding:0"><div style="padding:0 0.25em">

<ul><li><a href="Electronic_packaging" title="Electronic packaging">Electronic packaging</a></li>

<li><a href="Integrated_circuit_packaging" title="Integrated circuit packaging">Integrated circuit packaging</a></li>

<li><a href="List_of_electronic_component_packaging_types" title="List of electronic component packaging types">List of electronic component packaging types</a></li>

<li><a href="Printed_circuit_board" title="Printed circuit board">Printed circuit board</a></li>

<li><a href="Surface-mount_technology" title="Surface-mount technology">Surface-mount technology</a></li>

<li><a href="Through-hole_technology" title="Through-hole technology">Through-hole technology</a></li></ul>

</div></td></tr><tr><td class="navbox-abovebelow" colspan="2"><div>It is relatively common to find packages that contain other components than their designated ones, such as diodes or <a href="Voltage_regulator" title="Voltage regulator">voltage regulators</a> in transistor packages, etc.</div></td></tr></tbody></table></div></div><div><div class="zim-footer">

This article is issued from <a class="external text" title="Last edited on 2025-08-02" href="https://en.wikipedia.org/wiki/?title=Ball_grid_array&oldid=1303790456">Wikipedia</a>. The text is available under <a class="external text" href="https://creativecommons.org/licenses/by-sa/4.0/deed.en">Creative Commons Attribution-Share Alike 4.0</a> unless otherwise noted. Additional terms may apply for the media files.

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